Samsung, a leading tech company, has revealed an exciting plan to improve the design of chips used for artificial intelligence (AI). Starting in 2028, the company will begin using glass substrates in its chip packaging systems. This new approach promises to make AI chips faster, more precise, and cheaper to produce.
Currently, AI chips rely on silicon interposers, which are components that connect the chip’s processing unit (like a GPU) to high-speed memory called HBM (High Bandwidth Memory). This connection allows data to move quickly, which is critical for AI tasks. However, silicon interposers are expensive and hard to make smaller, which is a challenge as AI demands more powerful and compact chips.
Samsung’s solution is to replace silicon interposers with glass ones. Glass substrates could improve how components communicate, making chips more efficient. Unlike competitors who are working with large glass panels (about 510 x 515 millimeters), Samsung is focusing on smaller ones (under 100 x 100 millimeters). While this might be less efficient for large-scale production, it could help Samsung start making these chips faster and speed up testing new designs.
Samsung is also using a special production method called Panel Level Packaging (PLP) at its Cheonan campus. Instead of using round wafers like most companies, Samsung will use square panels, which offer more flexibility when assembling and packaging chips.
This shift to glass substrates is part of Samsung’s bigger plan to offer a complete package for AI chip development. By combining its chip manufacturing, HBM memory production, and advanced packaging, Samsung aims to provide a one-stop solution for companies creating AI technologies.
Other companies, like AMD, are also exploring glass substrates, but Samsung’s clear plan positions it as a leader in this innovative change.
